Treating C45 steel with solid powder aluminizing for selective soldering tool applications

Absztrakt

Steel (and metals, in general) substrates exhibit good wettability with metal melts due to the similar bonds. However, when immersed in the melt, dissolution of substrate atoms usually occurs, which leads to the degradation of substrate. To enhance the dissolution resistance of the substrate, ceramic coatings are applied as barriers in such applications, where good wetting is not a requirement. When good wettability must be maintained (for instance, soldering nozzles), the enhancement of dissolution resistance is not that easy. The aim of our research is to test novel surface modification methods of steel substrates to enhance the dissolution resistance against metal melts whilst maintaining good wettability. Based on its favourable properties, solid powder aluminizing was chosen as the applied treatment. The present manuscript presents the establishment of the aluminizing set-up, the treatment parameters and the first obtained aluminized steel samples.